Bonding
Seamless integration of functional zones
Bonding enables stable, low-profile joins between electrodes, textile layers, and conductive structures. The technique delivers high wearing comfort and helps prevent pressure points. We define temperature profiles, adhesives, and layer constructions for long-lasting performance—including wash and abrasion durability testing. Use cases: EMG zones, ECG pads, EMS layer structures.
faq
When is bonding the better choice compared to sewing?
Bonding is particularly suitable when flat, seamless constructions with high wearing comfort are required. The technology reduces pressure points, minimizes mechanical friction, and is ideal for sensitive functional zones with electrodes or conductive structures.
How does bonding affect durability and wash resistance?
When engineered correctly, bonding processes create stable joins that withstand many wash cycles. Material selection, adhesives, and process parameters are defined per project and validated through wash, ageing, and stress tests. In many cases, a combination of Cut & Sew and bonding is the best solution.
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