Bonding Seamless integration of functional zones
Bonding creates flat, seamless joins between electrodes, conductive structures, and textile layers. It is especially suitable for applications that require high wearing comfort, low mechanical friction, and reliable function in sensitive zones. Material selection, adhesive systems, and process parameters are defined project-specifically and validated through wash, ageing, and stress tests. In many cases, a combination of Cut & Sew and bonding is the best solution.
FAQ
When is Bonding the better choice compared to sewing?
Bonding is particularly suitable when flat, seamless constructions with high wearing comfort are required. The technology reduces pressure points, minimizes mechanical friction, and is ideal for sensitive functional zones with electrodes or conductive structures.
How does Bonding affect durability and wash resistance?
When engineered correctly, Bonding creates stable joins that withstand many wash cycles. Material selection, adhesives, and process parameters are defined per project and validated through wash, ageing, and stress tests. In many cases, a combination of Cut & Sew and Bonding is the best solution.
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